XYD-HVS300/600 Small Packaging Adhesive Supply System

XYD-HVS300/600 Small Packaging Adhesive Supply System

Suitable for feeding 300-600ml glue to small packages;
 Adhesive suitable for high viscosity, high filling, and high abrasive fillers;
 Adopting a vacuum pressure plate method, the air inside the raw material bucket can be automatically evacuated without the need for manual exhaust or glue removal, greatly reducing the amount of glue;
 Compared to the atmospheric pressure plate feeding system, it avoids manual exhaust and glue removal during the replacement of raw material barrels, greatly reducing raw material waste, and avoiding the problem of prolonged contact and reaction between glue and air, which leads to a shorter effective adaptation period of glue. Similarly, it effectively isolates water vapor;
 The glue can be stored for a long time after shutdown;

  Application scope

 Main application industries: automotive electronics, industrial electronics, electrical industry, new energy, aviation/aerospace/navigation, lighting, communication/power supply, power tools, electronic components, etc.

 Main product applications: automotive electronics, industrial equipment, sensors, transformers, ignition coils, capacitors, module power supplies, control systems, communication equipment, inverters, motors, household appliances, power tools, etc.

 Application resin: Single component adhesive.Single component/two-component small packaging adhesive.

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